Kondo, T., & Petersen, J. (2023). Evaluation of solvent swelling pre-treatment combined with ammonia leaching using waste etchant from printed circuit board manufacturing for copper recovery from waste printed circuit boards. Department of Chemical Engineering.
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Chicago Style (17th ed.) Citation
Kondo, Takunda, and Joachim Petersen. Evaluation of Solvent Swelling Pre-treatment Combined with Ammonia Leaching Using Waste Etchant from Printed Circuit Board Manufacturing for Copper Recovery from Waste Printed Circuit Boards. Department of Chemical Engineering, 2023.
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MLA (9th ed.) Citation
Kondo, Takunda, and Joachim Petersen. Evaluation of Solvent Swelling Pre-treatment Combined with Ammonia Leaching Using Waste Etchant from Printed Circuit Board Manufacturing for Copper Recovery from Waste Printed Circuit Boards. Department of Chemical Engineering, 2023.
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Warning: These citations may not always be 100% accurate.