(2026). Multi-field coupled vibration analysis of sandwich piezoelectric semiconductor cylindrical shells under thermal loading. Archive of Applied Mechanics.
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Chicago Style (17th ed.) Citation
"Multi-field Coupled Vibration Analysis of Sandwich Piezoelectric Semiconductor Cylindrical Shells Under Thermal Loading."
Archive of Applied Mechanics 2026.
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MLA (9th ed.) Citation
"Multi-field Coupled Vibration Analysis of Sandwich Piezoelectric Semiconductor Cylindrical Shells Under Thermal Loading."
Archive of Applied Mechanics, 2026.
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Warning: These citations may not always be 100% accurate.