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A study of copper diffusion through Pd₂Si thin films

It is now generally recognized that unless an alternative for aluminium is found the resistivity of the metal interconnects will soon limit device performance. Copper, with its low resistivity and greater resistance to electromigration is one of the obvious substitutes. However, before aluminium can...

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Main Author: Geduld, Dieter Rudi
Other Authors: Comrie, Craig M
Format: Thesis
Language:English
Published: Department of Physics 2016
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access_status_str Open Access
author Geduld, Dieter Rudi
author2 Comrie, Craig M
author_browse Comrie, Craig M
Geduld, Dieter Rudi
author_facet Comrie, Craig M
Geduld, Dieter Rudi
author_sort Geduld, Dieter Rudi
collection Thesis
description It is now generally recognized that unless an alternative for aluminium is found the resistivity of the metal interconnects will soon limit device performance. Copper, with its low resistivity and greater resistance to electromigration is one of the obvious substitutes. However, before aluminium can be replaced by copper, a careful study of the reactivity of copper with metal-silicides used in devices needs to be carried out. This study involves a dynamic RBS investigation of the reaction of copper with Pd₂Si films grown on Si<100> and Si<lll> substrates. It was found that copper diffused through the Pd₂Si layer and reacted with the single crystal silicon substrate at relatively low temperatures. The onset temperature observed for copper diffusion was found to differ for Pd2Si films grown on the two different substrate orientations, Si<100> and Si<lll>. Measurements of the activation energies for Cu-silicide growth on Pd₂Si/Si<100> and Pd₂Si/Si<lll> were also made.
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institution University of Cape Town (South Africa)
language eng
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license_str Not specified — see source repository
provenance_str_mv Harvested via OAI-PMH from UCTD — University of Cape Town Open Access Repository
publishDate 2016
publishDateRange 2016
publishDateSort 2016
publisher Department of Physics
publisherStr Department of Physics
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source_str UCTD — University of Cape Town Open Access Repository
spelling oai:open.uct.ac.za:11427/18431 A study of copper diffusion through Pd₂Si thin films Geduld, Dieter Rudi Comrie, Craig M Physics It is now generally recognized that unless an alternative for aluminium is found the resistivity of the metal interconnects will soon limit device performance. Copper, with its low resistivity and greater resistance to electromigration is one of the obvious substitutes. However, before aluminium can be replaced by copper, a careful study of the reactivity of copper with metal-silicides used in devices needs to be carried out. This study involves a dynamic RBS investigation of the reaction of copper with Pd₂Si films grown on Si<100> and Si<lll> substrates. It was found that copper diffused through the Pd₂Si layer and reacted with the single crystal silicon substrate at relatively low temperatures. The onset temperature observed for copper diffusion was found to differ for Pd2Si films grown on the two different substrate orientations, Si<100> and Si<lll>. Measurements of the activation energies for Cu-silicide growth on Pd₂Si/Si<100> and Pd₂Si/Si<lll> were also made. 2016-03-30T14:51:55Z 2016-03-30T14:51:55Z 1997 Master Thesis Masters MSc http://hdl.handle.net/11427/18431 eng application/pdf Department of Physics Faculty of Science University of Cape Town
spellingShingle Physics
Geduld, Dieter Rudi
A study of copper diffusion through Pd₂Si thin films
thesis_degree_str Master's
title A study of copper diffusion through Pd₂Si thin films
title_full A study of copper diffusion through Pd₂Si thin films
title_fullStr A study of copper diffusion through Pd₂Si thin films
title_full_unstemmed A study of copper diffusion through Pd₂Si thin films
title_short A study of copper diffusion through Pd₂Si thin films
title_sort study of copper diffusion through pd₂si thin films
topic Physics
url http://hdl.handle.net/11427/18431
work_keys_str_mv AT gedulddieterrudi astudyofcopperdiffusionthroughpd2sithinfilms
AT gedulddieterrudi studyofcopperdiffusionthroughpd2sithinfilms